When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

-Kenwire- wrote When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

423C seems a little high. Wouldn't that cause 0003? We want the HANA to be around 215C right?

PYMustangs24 wrote

-Kenwire- wrote When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

423C seems a little high. Wouldn't that cause 0003? We want the HANA to be around 215C right?

Those are the temps I have gotten from many of the shop owners, I have used those temps and have been successful in reflows.

-Kenwire- wrote

PYMustangs24 wrote

-Kenwire- wrote When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

423C seems a little high. Wouldn't that cause 0003? We want the HANA to be around 215C right?

Those are the temps I have gotten from many of the shop owners, I have used those temps and have been successful in reflows.

Stop posting incorrect information; your trying to throw crap at a wall to see what sticks

lead free melting point is 220- 228c. That profile is garbage.


What machine are you using i can pm you a reflow profile if you want.

A baseline reflow profile should consist of 4-5 stages for a xbox

preheat bringing the board to around 85- 100c
soak using both top and bottom heat getting them even at around 140c Then, a next soaking stages bringing them the board to 170c.
Reflow Melting the solder bringing it up too 215 - 228c or slightly above.
Cooling Stopping all heat, letting the solder form again after melting, back to room temp.


Important to Always use FLUX it helps the solder flow at melting otherwise you will just be left with a dried out solder ball that lacks its form and will be extremly weak and brittle.
I recommend ChipQuick SMD

Keep in mind of your stages and how long they are this should all take place quickly within a 8-15 min span. holding a temp for too long or too high can cuase problems, bridging and delamination. Please do not 400c+ is goign to kill our gpu and yes you will get no power or 0003.


Leaded solder is about 195c melting point, please read this it will give you a better understanding.
Reflow soldering:
[ Register or Signin to view external links. ]

-Mafia5K- wrote

-Kenwire- wrote

PYMustangs24 wrote

-Kenwire- wrote When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

423C seems a little high. Wouldn't that cause 0003? We want the HANA to be around 215C right?

Those are the temps I have gotten from many of the shop owners, I have used those temps and have been successful in reflows.

Stop posting incorrect information; your trying to throw crap at a wall to see what sticks

lead free melting point is 220- 228c. That profile is garbage.


What machine are you using i can pm you a reflow profile if you want.

A baseline reflow profile should consist of 4-5 stages for a xbox

preheat bringing the board to around 85- 100c
soak using both top and bottom heat getting them even at around 140c Then, a next soaking stages bringing them the board to 170c.
Reflow Melting the solder bringing it up too 215 - 228c or slightly above.
Cooling Stopping all heat, letting the solder form again after melting, back to room temp.


Important to Always use FLUX it helps the solder flow at melting otherwise you will just be left with a dried out solder ball that lacks its form and will be extremly weak and brittle.
I recommend ChipQuick SMD

Keep in mind of your stages and how long they are this should all take place quickly within a 8-15 min span. holding a temp for too long or too high can cuase problems, bridging and delamination. Please do not 400c+ is goign to kill our gpu and yes you will get no power or 0003.


Leaded solder is about 195c melting point, please read this it will give you a better understanding.
Reflow soldering:
[ Register or Signin to view external links. ]

Mafia knows what he is talking about so go with his temps and that should make your reflows more effective.

-Mafia5K- wrote

-Kenwire- wrote

PYMustangs24 wrote

-Kenwire- wrote When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

423C seems a little high. Wouldn't that cause 0003? We want the HANA to be around 215C right?

Those are the temps I have gotten from many of the shop owners, I have used those temps and have been successful in reflows.

Stop posting incorrect information; your trying to throw crap at a wall to see what sticks

lead free melting point is 220- 228c. That profile is garbage.


What machine are you using i can pm you a reflow profile if you want.

A baseline reflow profile should consist of 4-5 stages for a xbox

preheat bringing the board to around 85- 100c
soak using both top and bottom heat getting them even at around 140c Then, a next soaking stages bringing them the board to 170c.
Reflow Melting the solder bringing it up too 215 - 228c or slightly above.
Cooling Stopping all heat, letting the solder form again after melting, back to room temp.


Important to Always use FLUX it helps the solder flow at melting otherwise you will just be left with a dried out solder ball that lacks its form and will be extremly weak and brittle.
I recommend ChipQuick SMD

Keep in mind of your stages and how long they are this should all take place quickly within a 8-15 min span. holding a temp for too long or too high can cuase problems, bridging and delamination. Please do not 400c+ is goign to kill our gpu and yes you will get no power or 0003.


Leaded solder is about 195c melting point, please read this it will give you a better understanding.
Reflow soldering:
[ Register or Signin to view external links. ]

Thanks for the response. I use a Aoyue 968 and a T8280. I have a couple of test boards to so if I need to run some tests to get the correct temperatures for my setup , I can do that aswell. Also, where exactly to I place my thermocouple? On the board or on the chip?
Thanks

PYMustangs24 wrote

-Mafia5K- wrote

-Kenwire- wrote

PYMustangs24 wrote

-Kenwire- wrote When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

423C seems a little high. Wouldn't that cause 0003? We want the HANA to be around 215C right?

Those are the temps I have gotten from many of the shop owners, I have used those temps and have been successful in reflows.

Stop posting incorrect information; your trying to throw crap at a wall to see what sticks

lead free melting point is 220- 228c. That profile is garbage.


What machine are you using i can pm you a reflow profile if you want.

A baseline reflow profile should consist of 4-5 stages for a xbox

preheat bringing the board to around 85- 100c
soak using both top and bottom heat getting them even at around 140c Then, a next soaking stages bringing them the board to 170c.
Reflow Melting the solder bringing it up too 215 - 228c or slightly above.
Cooling Stopping all heat, letting the solder form again after melting, back to room temp.


Important to Always use FLUX it helps the solder flow at melting otherwise you will just be left with a dried out solder ball that lacks its form and will be extremly weak and brittle.
I recommend ChipQuick SMD

Keep in mind of your stages and how long they are this should all take place quickly within a 8-15 min span. holding a temp for too long or too high can cuase problems, bridging and delamination. Please do not 400c+ is goign to kill our gpu and yes you will get no power or 0003.


Leaded solder is about 195c melting point, please read this it will give you a better understanding.
Reflow soldering:
[ Register or Signin to view external links. ]

Thanks for the response. I use a Aoyue 968 and a T8280. I have a couple of test boards to so if I need to run some tests to get the correct temperatures for my setup , I can do that aswell. Also, where exactly to I place my thermocouple? On the board or on the chip?
Thanks

Is the T8280 worth getting because i currently have a griddle and am wanting to upgrade but i dont know what to?

iSamXD wrote

PYMustangs24 wrote

-Mafia5K- wrote

-Kenwire- wrote

PYMustangs24 wrote

-Kenwire- wrote When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

423C seems a little high. Wouldn't that cause 0003? We want the HANA to be around 215C right?

Those are the temps I have gotten from many of the shop owners, I have used those temps and have been successful in reflows.

Stop posting incorrect information; your trying to throw crap at a wall to see what sticks

lead free melting point is 220- 228c. That profile is garbage.


What machine are you using i can pm you a reflow profile if you want.

A baseline reflow profile should consist of 4-5 stages for a xbox

preheat bringing the board to around 85- 100c
soak using both top and bottom heat getting them even at around 140c Then, a next soaking stages bringing them the board to 170c.
Reflow Melting the solder bringing it up too 215 - 228c or slightly above.
Cooling Stopping all heat, letting the solder form again after melting, back to room temp.


Important to Always use FLUX it helps the solder flow at melting otherwise you will just be left with a dried out solder ball that lacks its form and will be extremly weak and brittle.
I recommend ChipQuick SMD

Keep in mind of your stages and how long they are this should all take place quickly within a 8-15 min span. holding a temp for too long or too high can cuase problems, bridging and delamination. Please do not 400c+ is goign to kill our gpu and yes you will get no power or 0003.


Leaded solder is about 195c melting point, please read this it will give you a better understanding.
Reflow soldering:
[ Register or Signin to view external links. ]

Thanks for the response. I use a Aoyue 968 and a T8280. I have a couple of test boards to so if I need to run some tests to get the correct temperatures for my setup , I can do that aswell. Also, where exactly to I place my thermocouple? On the board or on the chip?
Thanks

Is the T8280 worth getting because i currently have a griddle and am wanting to upgrade but i dont know what to?

I do like the it. I think it would be better than a griddle cause it has its own thermo couple so you know what temperature it's at unlike a griddle

PYMustangs24 wrote

iSamXD wrote

PYMustangs24 wrote

-Mafia5K- wrote

-Kenwire- wrote

PYMustangs24 wrote

-Kenwire- wrote When you're reflowing Xbox's you always want to use flux(most likely the reason your repairs are failing) and also want to make sure you raise the temp in small increments and make sure you don't accidentally move the chip when you are reflowing.

These are the the temps I reflow my consoles at:

270 degrees 60 seconds
360 degrees 60 seconds
423 degrees 45 seconds

Pm me if you have any questions.

423C seems a little high. Wouldn't that cause 0003? We want the HANA to be around 215C right?

Those are the temps I have gotten from many of the shop owners, I have used those temps and have been successful in reflows.

Stop posting incorrect information; your trying to throw crap at a wall to see what sticks

lead free melting point is 220- 228c. That profile is garbage.


What machine are you using i can pm you a reflow profile if you want.

A baseline reflow profile should consist of 4-5 stages for a xbox

preheat bringing the board to around 85- 100c
soak using both top and bottom heat getting them even at around 140c Then, a next soaking stages bringing them the board to 170c.
Reflow Melting the solder bringing it up too 215 - 228c or slightly above.
Cooling Stopping all heat, letting the solder form again after melting, back to room temp.


Important to Always use FLUX it helps the solder flow at melting otherwise you will just be left with a dried out solder ball that lacks its form and will be extremly weak and brittle.
I recommend ChipQuick SMD

Keep in mind of your stages and how long they are this should all take place quickly within a 8-15 min span. holding a temp for too long or too high can cuase problems, bridging and delamination. Please do not 400c+ is goign to kill our gpu and yes you will get no power or 0003.


Leaded solder is about 195c melting point, please read this it will give you a better understanding.
Reflow soldering:
[ Register or Signin to view external links. ]

Thanks for the response. I use a Aoyue 968 and a T8280. I have a couple of test boards to so if I need to run some tests to get the correct temperatures for my setup , I can do that aswell. Also, where exactly to I place my thermocouple? On the board or on the chip?
Thanks

Is the T8280 worth getting because i currently have a griddle and am wanting to upgrade but i dont know what to?

I do like the it. I think it would be better than a griddle cause it has its own thermo couple so you know what temperature it's at unlike a griddle

Ah nice well i only bought the griddle for 30GBP so it will do intil i can afford an upgrade